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Saturday, October 16, 2010

Application Specific Integrated Circuits (ASIC)

Application Specific Integrated Circuits (ASIC)

Introduction:


ICs are made on a thin (a few hundred microns thick), circular silicon wafer, with each
Wafer Holding hundreds of die (sometimes people use dies or dice for the plural of die).

The transistors and wiring are made from many layers (usually between 10 and 15
distinct layers) built on top of one another. Each successive mask layer has a pattern that is
defined using a mask similar to a glass photographic slide.

The first half-dozen or so layers define the transistors. The last half-dozen or so layers
define the metal wires between the transistors (the interconnect).


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