Novel RF Circuits Using MEMS Devices and Silicon Micromachining

Novel RF Circuits Using MEMS Devices and Silicon Micromachining

Abstract

Communications needs of future systems require increasing functionality and performance endurance to allow for successful insertion of new highly integrated MEMS sensors and instruments, now commonly planned for the new generation of wireless sensors. To maximize data transfer, reduce size and minimize operation cost, communications RF front-ends are forced to move to higher frequencies. Circuit miniaturization can be achieved by implementing a number of enabling technologies, which will allow the development of novel low-energy/low-cost and high-performance RF devices. These technologies include new circuit and component architectures, low- cost adaptive and re-configurable phased array antennas, millimeter-wave devices, advanced materials and novel integration techniques, integrated systems on a chip, and new packaging methods for high-frequency electronics. RF micromachining and MEMS technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems, and are expected to have significant application in the development of low-cost antenna arrays and re-configurable apertures.

With better selectivity provided by MEMS, transceivers will now be able to function in a variety of environments, since co-site and other interferers will be much less of a problem. The use of high-Q passive components in transceivers allows one to relax the design specifications for the surrounding transistor circuits. In particular, dynamic range and phase noise specifications can be greatly relaxed, allowing not only substantial power reduction (as described above), but also making possible the use of less expensive technologies for certain functions. While the RF MEMS technology has demonstrated the potential to revolutionize the architecture of modern communications systems, it has not been designed for performance in harsh environments. RF MEMS technology requires further development to be able to provide successful performance and primarily very broad bandwidth and very high-isolation in addition to the ability to handle high RF power. This presentation will describe the opportunities and challenges offered by this technology.