A Fast Simulation Approach for Inductive Effects of VLSI Interconnects

A Fast Simulation Approach for Inductive Effects of VLSI Interconnects

ABSTRACT:

Modeling on-chip inductive effects for interconnects of multiGHz microprocessors remains challenging. SPICE simulation of these effects is very slow because of the large number of mutual inductances. Meanwhile, ignoring the nonlinear behavior of drivers in a fast linear circuit simulator results in large errors for the inductive effect.

In this paper, a fast and accurate time-domain transient analysis approach is presented, which captures the non-linearity of circuit drivers, the effect of non-ideal ground and de-coupling capacitors in a bus structure. The proposed method models the non-linearity of drivers in conjunction with specific bus geometries. Linearized waveforms at each driver output are incorporated into an interconnect reduced-order simulator for fast transient simulation. In addition, non-ideal ground and de-coupling capacitor models enable accurate signal and ground bounce simulations. Results show that this simulation approach is upto 68x faster than SPICE while maintaining 95% accuracy.

INTRODUCTION:

There is no doubt that our daily lives are significantly affected by electronic engineering technology. This is true on the domestic scene, in our professional disciplines, in the workplace, and in leisure activities.
The revolutionary changes have taken in this field in a relatively short time and it is also certain that even more dramatic advances will be made in the next decade.

Electronics as we know it today is characterized by reliability, low power dissipation, extremely low weight and volume, and low cost with an ability to cope easily with a high degree of sophistication and complexity.
The integrated circuit has made possible the design of powerful and flexible processors which provide highly intelligent and adaptable devices for the user.

The vast majority of present day electronics is the result of the invention of the transistor in 1947.The very first integrated circuit (IC) emerged at the beginning of 1960 and since that time there have already been four generations of ICs: small scale integration (SSI), medium scale integration (MSI), large scale integration (LSI), very large scale integration (VLSI).Now we are beginning to see the emergence of the fifth generation, ultra large scale integration (ULSI).


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