THERMAL CHALLENGES OF NEXT GENERATION ELECTRONIC SYSTEMS

THERMAL CHALLENGES OF NEXT GENERATION ELECTRONIC SYSTEMS

ABSTRACT:

In near future the world will see increasingly compact computer chips and more circuitry will be cramped into a smaller area, producing additional heat. Because excess heat reduces the performance of computer chips and can ultimately destroy the delicate circuits, it will be important to develop new cooling technologies.

This paper mainly deals with the effect of temperature on the performance of electronic systems by taking the case study of microprocessor and the cooling systems adopted now and proposes a possible future cooling system of fans, which can be fitted on to small electronic circuitry. These fans can reduce the surface temperature of the circuitry to a significant extent. These are moved back and forth by “piezoelectric” ceramic material that is attached on to the blade. The cramped interiors of laptop computers and cell phones contain empty spaces that are too small to house conventional fans but large enough to accommodate the new fans, some of which have blades about an inch long. These fans might not replace the existing fans but can be used to enhance the cooling provided by the conventional fans.


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